Process flow of PCB patch processing
Screen printing: its role is to solder paste or patch glue to the PCB pad to prepare for the welding of components. The equipment used is screen printer (screen printing machine), which is located at the front end of SMT production line.
Dispensing: it is the glue drops to the fixed position of PCB, its main function is to fix the components to the PCB board. The equipment used is dispensing machine, which is located at the front end of SMT production line or behind the detection equipment.
Mounting: its function is to install the surface mount components accurately to the fixed position of PCB. The equipment used is placement machine, which is located behind the screen printing machine in SMT production line.
Curing: the function is to melt the adhesive, so that the surface mount components are firmly bonded to the PCB board. The equipment used is a curing oven, which is located behind the placement machine in the SMT production line.
Reflow soldering: its role is to melt solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is reflow furnace, located behind the placement machine in the SMT production line.
Cleaning: remove the harmful welding residues such as flux from the assembled PCB board. The equipment used for the washer is not fixed, it can be online or online.
Detection: its function is to detect the welding quality and assembly quality of the assembled PCB board. The equipment used are magnifying mirror, microscope, on-line test instrument (ICT), flying needle tester, automatic optical detection (AOI), X-RAY detection system, function test instrument and so on. Location can be configured in the right place of production line according to the need of testing.
Repair: its function is to reinspect the malfunctioning PCB board. The tools used are the soldering iron, the repair workstation and so on. Configure at any position in the production line.