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  • 线路板焊接中锡焊应具备哪些条件?
  • 本站编辑:杭州喜锦电子科技有限公司发布日期:2018-08-27 10:24 浏览次数:

SMT贴片加工05

线路板焊接中锡焊的条件
Conditions of soldering in circuit board welding
1、焊件应具有良好的可焊性
1. Weldments should have good weldability.
金属表面被熔融焊料浸润的特性叫作可焊性。
The characteristic of metal surface infiltrated by molten solder is called solderability.
有些金属材料具有良好的可焊性,但有些金属如钼、铬、钨等,可焊性非常差。即使是可焊性比较好的金属,如紫铜、黄铜等,由于其表面容易产生氧化膜,为了提高可焊性,一般需要采用表面镀锡、镀银等措施。
Some metal materials have good weldability, but some metals such as molybdenum, chromium, tungsten, etc. have very poor weldability. Even the metals with good solderability, such as red copper, brass and so on, are easy to produce oxide film on their surface. In order to improve the solderability, surface tin and silver plating are usually used.
2、要使用合适的焊剂
2, use the appropriate flux.
焊剂的作用是清除焊件表面氧化膜,并减小焊料融化后的表面张力,以利于浸润。不同的焊件,不同的焊接工艺,应选择不同的焊剂。如镍铬合金、不锈钢、铝等材料,不使用专用的特殊焊剂是很难实施锡焊的。
The function of the flux is to remove the oxide film on the surface of the weldment and reduce the surface tension of the melted solder to facilitate wetting. Different weldments should be selected for different weldments and different welding processes. It is difficult to solder materials such as nickel-chromium alloy, stainless steel and aluminum without special flux.
3、焊件表面必须清洁
3. The surface of the weldment must be clean.
焊件由于长期储存和污染等原因,其表面有可能产生氧化物、油污等。故在焊接前必须清洁表面,以保证焊接质量。
Due to long-term storage and contamination, welding parts may produce oxides and oil stains on the surface. Therefore, the surface must be cleaned before welding to ensure welding quality.
4、要加热到适当的温度
4, heating to the right temperature.
在焊接过程中,既要将焊锡熔化,又要将焊件加热至熔化焊锡的温度。只有在足够高的温度下,焊料才能充分浸润,并扩散形成合金结合层。
During welding, solder is melted and the weldment is heated to the temperature of molten solder. Only at sufficiently high temperatures can the solder be sufficiently infiltrated and diffused to form an alloy bonding layer.

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